Imp solder paste

Applying solder paste to the soldering surfaces of printed circuit boards facilitates an electrically well-conducting solder joint. After the components to be soldered are placed in the paste, the soldering process causes the solder paste particles to fuse with both the printed circuit boards and the component contacts. The flux in the solder paste reduces surface tension, thereby facilitating the melting process. This process promotes the formation of an alloy during soldering. In practice, it is easy to apply: simply apply solder paste to the surface or to the desoldering braid before soldering. Ask a product question